ESD Packaging Market Overview

The Global ESD Packaging Market reached US$ 2.2 billion in 2022 and is expected to reach US$ 3.4 billion by 2030, growing with a CAGR of 5.7% during the forecast period 2023-2030.

The ESD packaging market in the Asia-Pacific region has been experiencing significant growth, driven by the expansion and development of the electronics industry. In 2022, the Chinese government announced plans to expand the domestic market for electronic components to 2.1 trillion yuan (US$ 327 billion) by 2023. This ambitious goal underscores the substantial growth potential in the electronics sector, which is a major driver of the ESD packaging market. The Chinese government aims to develop 15 globally competitive electronic components manufacturers with annual sales of 10 billion yuan or more. This focus on competitiveness necessitates stringent quality control and ESD protection, further boosting the ESD packaging market.

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ESD Packaging Market Dynamics

The ESD packaging market is expected to grow alongside the expanding global semiconductor packaging industry. According to the Semiconductor Industry Association, the industry is projected to rebound with a growth rate of 11.9% in 2024. As electronic components become increasingly sensitive, even minor electrostatic discharges can cause irreparable damage. Consequently, semiconductor manufacturers and suppliers are adopting advanced ESD packaging solutions to protect their products during storage and transportation

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market segmentation

by prduct

Bond

By Material

Metal

Polypropylene 

Polyvinyl Chloride

Others

By Application

Equipment

Explosive Powder

Drugs

By End User

Network and Telecommunications Industry

Consumer Electronics & Computer Peripherals

Automotive Industry

Military and Defense

Healthcare

Aerospace

key players

 Nefab, Desco Industries, Inc., Protective Pak, Conductive Containers, Inc., ACL Staticide, Teknis Limited, Statclean Technology (S) Pte Ltd, GWP Group, DS Smith plc and Sealed Air Corporation .

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